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Contact Us GLOBAL Search this site 日本語 中文 Corporate Overview Products and Services Research and Development Sustainability News Corporate Overview Message from the Management Philosophy Quick Guide to JX Metals Business Segments Corporate Data Organization and Executive Officers Corporate History Operating Sites and Group Companies Long-Term Vision and Medium-Term Management Plan Purchasing Information Products and Services Search by Category Copper Alloys and Special Steel Products Copper Foil Sputtering Targets Compound Semiconductors and Crystal Materials Metal and Compound Powders Special Ceramic Powders High Purity Metals Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service MoSi2 Heater Shielding Materials Nonferrous Metals and Chemical Products Products Under Development Search by Keyword Semiconductors and Sensors Circuit Boards Assembly Displays Batteries and Energy Additive Manufacturing Connectors Magnetic Devices Electromagnetic Shielding Communications Optics Camera Modules Piezoelectricity Thermal Control Research and Development Our Core Technologies Contributing to Societal Growth and Innovation Initiatives for Co-creation Collaboration in the Group SQUARE LAB Sustainability Sustainability Report Toward Net-Zero CO2 Emissions Activities in Environmental Conservation CSR Purchasing News News Release Trade Fairs and Exhibitions MENU HOME Products and Services Copper Alloys and Special Steel Products Copper Alloy Strip Hyper Phosphor Bronze Copper Alloy Strip Hyper Phosphor Bronze Overview For decades, we have been working to improve the properties of phosphor bronze. Thanks to precision process control technology, we have succeeded in developing Hyper Phosphor Bronze, with superior strength and bend formability despite having similar alloy makeup as conventional products. We have obtained a wide range of patents covering Hyper Phosphor Bronze, and have achieved the top market share in the industry. Phosphor bronze is a copper alloy that has tin and phosphorus as its main alloying elements. Combining high strength and bend formability, it is used mainly for connector pins in personal computers, mobile phones, and other electronic devices. Today this alloy has become an indispensable metal material in our data-driven society. Compare Features and Typical Applications Alloy name Composition Features Applications C5210 (HP) Hyper Series Cu-8Sn Phosphor bronze for springs, with enhanced strength and bend formability Connectors, switches C5240 (HP) Hyper Series Cu-10Sn Strength superior to C5210 (HP) Connectors, switches Compare Composition and Properties Composition and Properties of Hyper Phosphor Bronze and Phosphor Bronze Chemical Composition (wt%) Copper Alloy Name Hyper Phosphor Bronze Phosphor Bronze C5210 (HP) C5240 (HP) C5111 C5102 C5191 C5212 C5210 Chemical Composition (wt%) Cu : Rest Sn : 8.0 P : 0.2 Cu : Rest Sn : 10.0 P : 0.15 Cu : Rest Sn : 4.0 P : 0.08 Cu : Rest Sn : 5.0 P : 0.2 Cu : Rest Sn : 6.0 P : 0.2 Cu : Rest Sn : 8.0 P : 0.2 Cu : Rest Sn : 8.0 P : 0.2 Physical Properties Copper Alloy Name Hyper Phosphor Bronze Phosphor Bronze C5210 (HP) C5240 (HP) C5111 C5102 C5191 C5212 C5210 Specific Gravity (g/cm3) 8.80 8.78 8.87 8.86 8.83 8.80 8.80 Modulus of Elasticity (GPa) 110 100 110 110 110 110 110 Electrical Conductivity (%IACS @20&＃8451;) 12 10 17 15 14 13 13 Poisson's Ratio 0.33 0.33 0.33 0.33 0.33 0.33 0.33 Mechanical Properties Copper Alloy Name Hyper Phosphor Bronze Phosphor Bronze C5210 (HP) C5240 (HP) C5111 C5102 C5191 C5212 C5210 Tensile Strength (MPa) O - - 295min 305min 315min 345min - 1/4H - - 345-440 375-470 390-510 390-510 - 1/2H - - 410-510 470-570 490-610 490-610 470-610 H 590-705 650-750 490-590 570-665 590-685 590-705 590-705 EH 685-785 750-850 570min 620min 635min 685min 685-785 SH 735-835 850-950 - - - - 735-835 ESH 770-885 950-1050 - - - - - XSH 835-1000 1000-1200 - - - - - 0.2% YieldStrength (MPa) O - - - - - - - 1/4H - - - - - - - 1/2H - - - - - - - H (565) 580-690 - - - - (528) EH (688) 650-790 - - - - (667) SH (760) 780-920 - - - - (710) ESH (823) 900-1030 - - - - - XSH (879) 950-1190 - - - - - Elongation (%) O - - 38min 40min 42min 45min - 1/4H - - 25min 28min 35min 40min - 1/2H - - 12min 15min 20min 30min 27min H 20min 11min 7min 7min 8min 12min 20min EH 11min 9min 3min 4min 5min 5min 11min SH 9min 5min - - - - 9min ESH 5min 1min - - - - - XSH 1min - - - - - - VickersHardness (Hv) O - - - - - - - 1/4H - - 80-150 90-160 100-160 100-160 - 1/2H - - 120-180 130-190 150-205 150-205 140-205 H 185-235 200-240 150-200 170-220 180-230 180-235 185-235 EH 210-260 230-270 - 190min 200min 210min 210-260 SH 230-270 250-290 - - - - 230-270 ESH 245-285 270-310 - - - - - XSH - 290min - - - - - Standard specs. (Typical values) Formability Copper Alloy Name Hyper Phosphor Bronze Phosphor Bronze C5210 (HP) C5240 (HP) C5111 C5102 C5191 C5212 C5210 Minimum Bend Radius / t Badway 1/2H - - - - - - - H 0.0 0.0 (t=0.1mm) - - - - 0.5 EH 0.5 1.0 (t=0.1mm) - - - - 2.0 SH 2.0 3.0 (t=0.1mm) - - - - 2.5 ESH 4.0 - - - - - - Bad way 90°W-shape Bending Width=10mm Explanation of technical terms W-shaped Bending, Minimum Bend Radius U-shaped Bending, Minimum Bend Radius Good Way / Bad Way Contact Information From the Web Contact Form Inquiries accepted 24 hours a day Products and Services Products and Services TOP Search by Category Copper Alloys and Special Steel Products Copper Alloys and Special Steel Products TOP Copper Alloy Strip Copper Alloy Strip TOP Search for products Hyper Phosphor Bronze Hyper Phosphor Bronze TOP C5210 (HP) C5240 (HP) Titanium Copper Alloy Titanium Copper Alloy TOP C1990 C1990HP C1990HC NKT322 Corson Alloys Corson Alloys TOP C7025 NKC164 NKC164E NKC4419 NKC4820 NKC286 NKC286S NKC1816 NKC388 Phosphor Bronze Nickel Silver High Conductivity Alloys High Conductivity Alloys TOP NKE010 NKE012 Copper Alloy Foil Copper Alloy Foil TOP HS1200 Sn-Cu-PET foil for electromagnetic shielding C1990HP Foil (Titanium Copper Foil) Special Steel Products Special Steel Products TOP List of Properties Copper Foil Copper Foil TOP Treated Rolled Copper Foil Treated Rolled Copper Foil TOP HA and HA-V2 foil Surface Treatment JXEFL Series Electro-Deposited Copper Foil for Flexible Printed Circuits Copper Foil for Rigid Circuit Boards Sputtering Targets Sputtering Targets TOP What Is Sputtering? 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