ボンズカジノの長所と短所を含めて徹底解説 2024年3月

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Contact Us GLOBAL Search this site 日本語 中文 Corporate Overview Products and Services Research and Development Sustainability News Corporate Overview Message from the Management Philosophy Quick Guide to JX Metals Business Segments Corporate Data Organization and Executive Officers Corporate History Operating Sites and Group Companies Long-Term Vision and Medium-Term Management Plan Purchasing Information Products and Services Search by Category Copper Alloys and Special Steel Products Copper Foil Sputtering Targets Compound Semiconductors and Crystal Materials Metal and Compound Powders Special Ceramic Powders High Purity Metals Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service MoSi2 Heater Shielding Materials Nonferrous Metals and Chemical Products Products Under Development Search by Keyword Semiconductors and Sensors Circuit Boards Assembly Displays Batteries and Energy Additive Manufacturing Connectors Magnetic Devices Electromagnetic Shielding Communications Optics Camera Modules Piezoelectricity Thermal Control Research and Development Our Core Technologies Contributing to Societal Growth and Innovation Initiatives for Co-creation Collaboration in the Group SQUARE LAB Sustainability Sustainability Report Toward Net-Zero CO2 Emissions Activities in Environmental Conservation CSR Purchasing News News Release Trade Fairs and Exhibitions MENU HOME Products and Services Products and Services Search by Category Search by Keyword Copper Alloys and Special Steel Products Copper Alloys and Special Steel Products Copper Alloy Strip Hyper Phosphor Bronze Titanium Copper Alloy Corson Alloys Phosphor Bronze Nickel Silver High Conductivity Alloys Search for products Copper Alloy Foil HS1200 Sn-Cu-PET foil for electromagnetic shielding C1990HP Foil (Titanium Copper Foil) Special Steel Products Copper Foil Copper Foil Treated Rolled Copper Foil JXEFL Series Electro-Deposited Copper Foil for Flexible Printed Circuits Copper Foil for Rigid Circuit Boards Sputtering Targets Sputtering Targets What Is Sputtering? Sputtering Targets for Semiconductors AlSc Sputtering Target Sputtering Targets for Flat Panel Displays Sputtering Targets for Optical Films Sputtering Targets for Magnetic Devices Sputtering Targets for Photovoltaic Cells Compound Semiconductors and Crystal Materials Compound Semiconductors and Crystal Materials Compound Semiconductor Substrates-InP, CdZnTe (CdTe)- Strontium Titanate (SrTiO3) Rutile Titanium Dioxide (TiO2) Magnesium silicide (Mg2Si) Single Crystal for Infrared Detector Metal and Compound Powders Metal and Compound Powders Tantalum and Niobium Materials High Purity Chlorides Metal Powders for Additive Manufacturing Other Metal Powders Special Ceramic Powders Special Ceramic Powders Negative Thermal Expansion Material ZrW2O8 High Purity Metals High Purity Metals High Purity Metals Low &#945; Tin Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service MoSi2 Heater Shielding Materials Shielding Materials 3D formable Sheets for Electromagnetic Shielding(Mighty Shield®) Sn-Cu-PET foil for electromagnetic shielding Nonferrous Metals and Chemical Products Nonferrous Metals and Chemical Products Refined Copper/Copper Cakes and Billets Precious Metals Rare Metals Sulfuric acid, slag, gypsum, etc. Products Under Development Products Under Development Special Ceramic Powders 3D formable Sheets for Electromagnetic Shielding(Mighty Shield®) Metal Powders for Additive Manufacturing High Purity Chlorides Lead-free Piezoelectric Powder Material AlSc Sputtering Target YAG Ceramics for Laser Applications Magnesium silicide (Mg2Si) Single Crystal for Infrared Detector Semiconductors and Sensors Semiconductors and Sensors For Front-end (Wafer) Processes Sputtering Targets for Semiconductors AlSc Sputtering Target Sputtering Targets for Magnetic Devices Sputtering Targets for Optical Films High Purity Chlorides Lead-free Piezoelectric Powder Material Tantalum and Niobium Materials For Back-end (Assembly) Processes Copper Alloys for Lead Frames Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service Low &#945; Tin Circuit Boards Circuit Boards Copper Foil Surface Treatment Agents Upinorg (high-purity copper sulfate) Tantalum and Niobium Materials Negative Thermal Expansion Material ZrW2O8 Low &#945; Tin High Strength Copper Alloys for Sockets Assembly Assembly Negative Thermal Expansion Material ZrW2O8 High Purity Metals Tantalum and Niobium Materials Low &#945; Tin Electroless UBM Plating Service Displays Displays Sputtering Targets for Flat Panel Displays Sputtering Targets for Optical Films Batteries and Energy Batteries and Energy HS1200 Sputtering Targets for Photovoltaic Cells Compound Semiconductor Substrates-InP, CdZnTe (CdTe)- Strontium Titanate (SrTiO3) Rutile Titanium Dioxide (TiO2) Tantalum and Niobium Materials High Purity Chlorides Additive Manufacturing Additive Manufacturing Metal Powders for Additive Manufacturing Connectors Connectors Copper Alloys for Board to Board Connectors Copper Alloys for FPC Connectors Copper Alloys for Backplane Connectors Alloys for Floating Connectors Copper Alloys for SIM Card Connectors Copper Alloys for USB Connectors Copper Alloys for Harness Connectors Surface Treatment Agents Magnetic Devices Magnetic Devices Sputtering Targets for Magnetic Devices Electromagnetic Shielding Electromagnetic Shielding Sn-Cu-PET foil for electromagnetic shielding 3D formable Sheets for Electromagnetic Shielding(Mighty Shield®) Communications Communications Surface Treatment AlSc Sputtering Target Compound Semiconductor Substrates-InP, CdZnTe (CdTe)- Strontium Titanate (SrTiO3) Rutile Titanium Dioxide (TiO2) Tantalum and Niobium Materials Optics Optics Sputtering Targets for Optical Films Compound Semiconductor Substrates-InP, CdZnTe (CdTe)- Strontium Titanate (SrTiO3) Rutile Titanium Dioxide (TiO2) YAG Ceramics for Laser Applications Tantalum and Niobium Materials High Purity Chlorides Magnesium silicide (Mg2Si) Single Crystal for Infrared Detector Camera Modules Camera Modules Titanium Copper Alloy Sputtering Targets for Optical Films High Purity Chlorides Piezoelectricity Piezoelectricity AlSc Sputtering Target Lead-free Piezoelectric Powder Material Thermal Control Thermal Control Copper Alloys for Cooling Modules Negative Thermal Expansion Material ZrW2O8 MoSi2 Heater Menu Contact Us Search Sitemap Page Up Corporate Overview Message from the Management Philosophy Quick Guide to JX Metals Corporation Business Segments Corporate Data Organization and Executive Officers Corporate History Operating Sites and Group Companies Long-Term Vision and Medium-Term Management Plan Purchasing Information Products and Services Search by Category Search by Keyword Research and Development Our Core Technologies Contributing to Societal Growth and Innovation Initiatives for Co-creation Collaboration in the Group SQUARE LAB Sustainability Sustainability Report Toward Net-Zero CO2 Emissions Activities in Environmental Conservation CSR Purchasing News News Release Trade Fairs and Exhibitions Close Page Up Corporate Overview Products and Services Research and Development Sustainability News Privacy Policy Terms of Use Sitemap COOKIE 設定 Copyright © JX Metals Corporation All Rights Reserved.

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