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Inquiry / Comment * Category ----- please select ----- Copper Alloys and Special Steel Products Copper Foil Sputtering Targets Compound Semiconductor and Crystal Materials Metal and Compound Powders Special Ceramic Powders High Purity Metals Shielding Materials Electroless UBM Plating Service Other Products Products under development Nonferrous Metals and Chemical Products Recycling Other Inquiries ----- please select ----- Copper Alloy Strip Special Steel Products Copper Alloy Foil Treated Rolled Copper Foil HA and HA-V2 foil JXEFL Series Electro-Deposited Copper Foil for Flexible Printed Circuits Other Item 精密めっき・プレス削除-関連カテゴリ2非表示 20240104粕田--> For Semiconductors For Lead-free Piezoelectric Devices For Flat Panel Displays For Optical Films For Magnetic Devices For Photovoltaic Cells Compound Semiconductor Substrates (InP, CdZnTe, CdTe) Strontium Titanate (SrTiO3) Rutile Titanium Dioxide (TiO2) Tantalum and Niobium Materials High Purity Chlorides Metal Powders for Additive Manufacturing High Temperature Sintering Sub-micron Copper Powder Other Metal Powders Negative Thermal Expansion Material ZrW2O8 High Purity Metals Low α Tin 3D formable Sheets for Electromagnetic Shielding Sn-Cu-PET foil for electromagnetic shielding Electroless UBM Plating Service Surface Treatment Agents Upinorg (high-purity copper sulfate) MoSi2 Heater Products under development Negative thermal expansion material ZrW2O8 3D formable Sheets for Electromagnetic Shielding Metal Powders for Additive Manufacturing High Purity Chlorides High Temperature Sintering Sub-micron Copper Powder YAG (Yttrium Aluminum Garnet) Ceramics Lead-free Piezoelectric Powder Material AlSc Sputtering Target Mg2Si Single Crystal for Infrared Detector Refined Copper/Copper Cakes and Billets Precious Metals Rare Metals Sulfuric acid, slag, gypsum, etc. Item /--> E-Scrap, E-Waste Opportunities for Recent Graduates Mid-career Opportunities Other information Name * E-mail Address * Company Name * Please fill in "in person" if you do not belong to an organization. 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